콘텐츠 본문
논문 해외 국제전문학술지(SCI급) Comparison of the removal efficiency for organic contaminants on silicon wafers stored in plastic boxes between UV/O3 and ECR oxygen plasma cleaning methods
- 학술지 구분 국제전문학술지(SCI급)
- 게재년월 2003-04
- 저자명 Kyunsuk Choi, Tae-Jong Eom, Chongmu Lee*
- 학술지명 Thin Solid Films
- 발행국가 해외
- 논문언어 외국어
논문 초록 (Abstract)
When wafers are stored in a plastic storage box to protect them from airborne contaminants, volatile organics from the polymeric construction material adsorb onto the wafer surface. Both UV/O3 and ECR oxygen plasma techniques have been found to completely remove these organic contaminants adsorbed on the silicon surfaces up to the detection limit. After cleaning, Si wafers were characterized using attenuated total reflection-Fourier transform infrared spectroscopy (ATR-FTIR) and atomic force microscopy (AFM). Organic contaminants were eliminated more efficiently by the ECR oxygen plasma technique than the UV/O3 technique when they were employed under optimum process conditions.
