콘텐츠 본문
논문 해외 국제전문학술지(SCI급) Fabrication of high current and low profile micromachined inductor with laminated Ni/Fe core
- 학술지 구분 국제전문학술지(SCI급)
- 게재년월 2002
- 저자명 Park, JW,Allen, MG,Joung, YH공동(참여),Park, JY
- 학술지명 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
- 발행처명 IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- 발행국가 해외
- 논문언어 외국어
- 전체저자수 4
논문 초록 (Abstract)
A new process for the fabrication of high current and very low profile micromachined inductors has been developed. This process involves the combination of mechanical lamination and electrodeposition of copper windings by means of LIGA-like lithography through thick epoxy photoresists. The dimension of the fabricated inductor is 16 mm/spl times/19 mm/spl times/1 mm. The fabricated inductor has an inductance value of 1.2 /spl mu/H with DC saturation current of 3 A and an electrical resistance of less than 30 m/spl Omega/ at 10 kHz.
