콘텐츠 본문
논문 해외 국제전문학술지(SCI급) Fabrication of Cu Wiring Touch Sensor via Laser Sintering of Cu Nano/Microparticle Paste on 3D-Printed Substrate
- 학술지 구분 국제전문학술지(SCI급)
- 게재년월 2021-01
- 저자명 안현식, 오애선, 김동환, 최윤석, 김경현, 배현철
- 학술지명 ADVANCED ENGINEERING MATERIALS
- 발행처명 WILEY-V C H VERLAG GMBH
- 발행국가 해외
- 논문언어 외국어
- 전체저자수 6
논문 초록 (Abstract)
This study investigates the applications of 3D printing technology in the wiring process used in the field of electronic packaging. A Cu wiring process is developed to replace the expensive Ag-based alternative primarily used in commercial 3D electronic circuit printing as per industry standards. The substrates needed for our experiments are developed using a 3D printer assembled prior to the research, through which poly-ether-ether-ketone (PEEK) proves to be a high-strength, high heat-resistance material capable of undergoing the packaging process. The Cu wiring process is performed via laser sintering in ambient condition using a Cu micro/nanoparticle paste. Adopting this method minimizes the cost and duration of the process without relying on inert atmosphere generation. The optimum laser sintering condition for the Cu paste is found to be two consecutive scans at 20 W. Energy dispersive X-ray spectroscopy (EDS) measurements show that the oxidation of the surface is about 1.35%, and further oxidation is prevented through epoxy molding. The touch sensor by Cu wiring module operate optimally even a month after its manufacture. 3D printing technology proves to be capable of replacing the wiring process used for electronic packaging.
