콘텐츠 본문
논문 해외 국제전문학술지(SCI급) Submicron interlayer for stabilizing thin Li metal powder electrode
- 학술지 구분 국제전문학술지(SCI급)
- 게재년월 2021-02
- 저자명 진다희,노영준,조태진,신동옥,송주혜,김주영,이영기,이홍경,유명현,이용민
- 학술지명 CHEMICAL ENGINEERING JOURNAL
- 발행처명 ELSEVIER SCIENCE SA
- 발행국가 해외
- 논문언어 외국어
- 전체저자수 10
- 논문 다운로드 링크(외부) https://doi.org/10.1016/j.cej.2020.126834
- 연구분야 공학 > 화학공학
논문 초록 (Abstract)
The surface area of the lithium metal electrode must be considered when attempting to suppress dendritic growth of lithium metal, as surface area can lower the effective current density. For this reason, lithium metal powder (LiMP) has attracted much attention for use in electrodes because of its higher surface area. However, repeated cycling, even in aging time, leads to delamination of lithium particles from flat metal current collectors and results excess dead lithium particles, even in LiMP electrodes. Herein, this problem is addressed by coating submicron-thickness carbon interlayers on copper current collectors for LiMP electrodes. This thin carbon layer plays important roles in both maintaining the interfacial contact between Cu foil and LiMP particles and lowering overpotential in Li/Li symmetric cells, which leads to improve electrochemical performance in thin LiMP (40 mu m) based cell. These enhancements are related to the enlarged surface area, as confirmed by higher adhesion of the electrode after precycling. Furthermore, the carbon materials are also believed to contribute to seeding for efficient lithium nucleation. Thus, thin carbon layers on current collectors can provide simple but powerful enhancements to the electrochemical performance of high-energy-density LMSBs.
